Effects of OSP and Im-Sn surface-finished substrates on microstructure and high speed shear performance of Sn10Sb solder joints
WANG Qin1, GU Huidong2, WANG Liuwei3, ZHOU Huiling3, WANG Jiajun1, WANG Xiaojing3
1. Yunnan Tin New Material Company Limited, Kunming 650000, Yunnan, China; 2. Research Institute for Special Structures, Aeronautical Composites AVIC, Jinan 250000, Shandong, China; 3. School of Materials Science and Engineering, Jiangsu University of Science and Technology, Zhenjiang 212000, Jiangsu, China
Abstract:The Sn10Sb alloy, with excellent thermal fatigue properties and relatively high fracture strength, has been widely used in market segments requiring heat fatigue resistance, but the highspeed shear performance of its solder joints under different surface-finished substrates is still lacking in research. The effects of organic solderability preservatives (OSP) and immersion-Sn (Im-Sn) surface-finished substrates on the mechanical properties of Sn10Sb (mass fraction of Sb is 10%) solder joints at shear rate of 1 000 mm/s were studied. The results show that compared with Sn10Sb bulk alloy, Sn-Sb compounds of 20-40 μm are uniformly dispersed in β-Sn matrix. Due to the uneven thermal field during melting and solidification, the coarse Sn-Sb compounds with the same size are most isolated on the surface, while a few of them gather in the interior and interface of solder joints, which can be explained by uneven distributed thermal field during heating and cooling process using Ansys finite element simulation. In addition, scanning electron microscope (SEM) and energy dispersive X-ray spectroscopy (EDS) were used to observe the solder joints, and it was found that the solder joints of two kinds of surface-finished substrates were both composed of β-Sn matrix, SnSb compounds and Cu6Sn5compounds. Compared with the microstructure of Sn10Sb/OSP solder joints, Sn10Sb/Im-Sn solder joints have more SnSb compounds and the interface Cu6Sn5 is thinner. This leads to higher shear strength but lower ductility of Sn10Sb/Im-Sn solder joints, resulting in lower shear energy. This study provides a theoretical support for the effects of OSP and Im-Sn surface-finished substrates on microstructure and high-speed shear performance of Sn10Sb solder joints.
王钦, 谷惠东, 汪刘伟, 周慧玲, 王加俊, 王小京. OSP和Im-Sn镀层对Sn10Sb焊点微观结构和高速剪切性能的影响[J]. 中国冶金, 2024, 34(1): 124-131.
WANG Qin, GU Huidong, WANG Liuwei, ZHOU Huiling, WANG Jiajun, WANG Xiaojing. Effects of OSP and Im-Sn surface-finished substrates on microstructure and high speed shear performance of Sn10Sb solder joints[J]. China Metallurgy, 2024, 34(1): 124-131.
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