
Effects of OSP and Im-Sn surface-finished substrates on microstructure and high speed shear performance of Sn10Sb solder joints
WANG Qin, GU Huidong, WANG Liuwei, ZHOU Huiling, WANG Jiajun, WANG Xiaojing
China Metallurgy ›› 2024, Vol. 34 ›› Issue (1) : 124-131.
Effects of OSP and Im-Sn surface-finished substrates on microstructure and high speed shear performance of Sn10Sb solder joints
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