
Simulation and analysis on thermal field of copper slag under different slow cooling system
ZHANG Heng-xing, ZHONG Shui-ping, CHEN Hang, WANG Jun-e, WU Xing-lin, JIAN Yong-zhang
China Metallurgy ›› 2020, Vol. 30 ›› Issue (10) : 76-83.
Simulation and analysis on thermal field of copper slag under different slow cooling system
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